Three dimensional microstructures and fabrication process

ABSTRACT

A method for fabricating three-dimensional microstructures is presented. The method includes: disposing a substantially planar reflow material between two molds; heating the reflow material while the reflow material is disposed between the two molds; and reflowing the reflow material towards the bottom surface of one of the molds by creating a pressure gradient across the reflow material. At least one of molds includes geometrics features that help to shape the reflow material and thereby form a complex three-dimensional microstructure.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. Ser. No. 14/985,859 filed Dec.31, 2015 which claims the benefit of U.S. Provisional Application No.62/098,451, filed on Dec. 31, 2014. The entire disclosures of the aboveapplications are incorporated herein by reference.

GOVERNMENT CLAUSE

This invention was made with government support under W31P4Q-11-1-0002awarded by the U.S. Army/Army Materiel Command. The Government hascertain rights in this invention.

FIELD

The present disclosure relates to three dimensional microstructures andfabrication processes for the same.

BACKGROUND

Recent advances in micro-electromechanical system (MEMS) technologiesresulted in the successful commercialization of high-performance sensorsand actuators in a variety of areas such as motion sensing, wirelesscommunication, energy harvesting, and healthcare. There is a growingneed for MEMS sensors with better resolution, lower noise, better biasstability, and larger dynamic range as well as a MEMS actuator withlarger actuation range and better long term stability.

The performance of MEMS sensors and actuators are limited by theirmaterials and structures. Most MEMS devices are made of silicon, metals,or polymers, which have low mechanical and optical quality factors (Q).Because of their low Q, they have large noise and small actuation range.One of the common sensors that require very high Q is a vibratoryrate-integrating gyroscope (RIG). Compared to the conventionalgyroscope, called the rate gyroscope (RG), the RIG offers severaladvantages including direct angular readout, large bandwidth, and largefull-scale range. The accuracy of the RIG is roughly inverselyproportional to its decay time constant (τ). The τ of silicon is limitedby thermoelastic damping (TED) mechanism to less than 100 seconds,comparing to several hundred seconds for an ultra-high-Q material suchas fused silica (FS). For this reason, it is desirable to fabricate theRIG using such materials. Most MEMS devices have two dimensional (2D)geometries because of limitations in existing microfabricationtechnologies. Sensors with these geometries tend to have worseperformance under external vibrations, shocks, and temperature driftsthan sensors with three dimensional (3D) geometries.

The hemispherical resonator gyroscope (HRG), developed by Delco in1980s, is the gyroscope with the state-of-art accuracy, sufficient toguide airplanes and space satellites. The HRG is made with fused silica,which is a material with an extremely high Q due to very low TED. TheHRG has a shape of a wineglass. The advantage of the wineglass geometryis that due to the symmetry of its structure, the vibrating energy doesnot leak through the anchor. Because of this, the sensor has a very highQ. Another advantage of the wineglass geometry is that, due its highrigidity in tilting and vertical directions, it has good vibrationinsensitivity. The problem of the HRG, however, is that because fusedsilica is very difficult to machine using the conventionalmicromachining technique, the wineglass resonator is made using manualgrinding and polishing techniques and assembled to the electrodes. Thismanufacturing process is expensive, slow, and inaccurate for makingmicro-scale sensors.

Thus, there remains a need for micro fabrication techniques to fabricate3D micro sensors with reflowable materials with good accuracy andextremely good surface smoothness (i.e., RMS roughness (R_(a))<1 nm).This section provides background information related to the presentdisclosure which is not necessarily prior art.

SUMMARY

This section provides a general summary of the disclosure, and is not acomprehensive disclosure of its full scope or all of its features.

In one aspect, a method is presented for fabricating three-dimensionalmicrostructures. The method includes: disposing a substantially planarreflow material on a first mold having a recess formed therein, whereinthe recess in the first mold defines a bottom surface and at least oneside surface, and the at least one side surface includes a protrusionprotruding into the recess; heating the reflow material while the reflowmaterial is disposed on the first mold; and reflowing the reflowmaterial towards the bottom surface of the first mold by creating apressure gradient across the reflow material, whereby the protrusion inthe at least one side surface helps to shape the reflow material andthereby form a three-dimensional microstructure.

In another aspect, the method includes: micromachining a first mold witha recess formed therein; micromachining a second mold with a recessformed therein, the recess defining a bottom surface and at least oneside surface; disposing a substantially planar reflow material betweenthe first mold and the second mold, such that the recess in the firstmold faces the recess in the second mold and thereby forms a cavity;heating the reflow material while the reflow material is disposedbetween the first mold and the second mold; and creating a pressuregradient across the reflow material to reflow the reflow materialtowards the bottom surface of the second mold, wherein the pressuregradient is controlled independently from the heating of the reflowmaterial.

In yet another aspect, the method includes: affixing a solid member to afirst mold having a recess formed therein, wherein the solid member isdisposed in the recess and the first mold defines a bottom surface andat least one side surface; disposing a substantially planar reflowmaterial on the first mold, wherein the reflow material covers therecess and the solid member disposed in the recess; heating the reflowmaterial while the reflow material is disposed on the first mold; andcreating a pressure gradient across the reflow material to reflow thereflow material towards and in contact with the solid member, wherebythe reflow material bonds with the solid member to form a unitarythree-dimensional microstructure.

Further areas of applicability will become apparent from the descriptionprovided herein. The description and specific examples in this summaryare intended for purposes of illustration only and are not intended tolimit the scope of the present disclosure.

DRAWINGS

The drawings described herein are for illustrative purposes only ofselected embodiments and not all possible implementations, and are notintended to limit the scope of the present disclosure.

FIGS. 1A and 1B are a perspective view and a cross-sectional side view,respectively, of an example resonator;

FIGS. 2A-2H are cross-sectional views of example shapes formicrostructures which may be fabricated in accordance with thisdisclosure;

FIG. 3A-3G are cross-sectional views of more example shapes formicrostructures with different types of anchor regions;

FIGS. 4A-4I are cross-sectional views of microstructures havingdifferent types of solid regions;

FIGS. 5A-5D are perspective views of example resonators withnon-axisymmetric shapes;

FIGS. 6A-6E are cross-sectional views illustrating an examplefabrication method in which the substrate flows away from the bottommold;

FIGS. 7A-7E are cross-sectional views illustrating an examplefabrication method in which the substrate flows toward the bottom mold

FIG. 8A-8E are cross-sectional views illustrating an example method forfabricating microstructures with features having different heights;

FIG. 9A-9E are cross-sectional views illustrating an example method forfabricating microstructures with hollow shells by reflow molding inlateral directions;

FIGS. 10A-10C are cross-sectional views illustrating a molding processfor frit of thermally reflowable material;

FIGS. 11A and 11B are cross-sectional views illustrating a reflowmolding process that uses a formerly blown shell as a mold for thesecond piece;

FIGS. 12A-14F are cross-sectional views illustrating process steps tocreate a microstructure bonded with solid pieces;

FIGS. 13A and 13B are a top view and a bottom view, respectively, of anexample resonator;

FIGS. 14A-14E are cross-sectional views illustrating process steps forreflow molding a stack of thermally reflowable layers;

FIGS. 15A-15H are cross-sectional views illustrating the process stepsfor creating a rate-integrating gyroscope;

FIGS. 16A-16G are cross-sectional views illustrating a reflow moldingprocess over a sacrificial layer to create narrow sensing and actuationgaps;

FIGS. 17A-17C are cross-sectional views illustrating process steps forcreating through hole in a reflown shell; and

FIGS. 18A-18C are cross-sectional views illustrating process steps forinserting a tube in the middle of a reflown shell.

Corresponding reference numerals indicate corresponding parts throughoutthe several views of the drawings.

DETAILED DESCRIPTION

Example embodiments will now be described more fully with reference tothe accompanying drawings.

Unlike most MEMS devices, the axisymmetric shells in this disclosure aretall, complex-shaped structures. These shapes are difficult to createusing conventional lithography-based MEMS fabrication processes. Thesestructures can be used, for example as resonators for navigation-gradevibratory rate-integrating gyroscopes (RIGs) due to: 1) very high Q dueto excellent structural symmetry and low anchor loss and 2) a highangular gain, due to large momentum perpendicular to the yaw axis. Whilereference is made throughout this disclosure to gyroscopes, it isunderstood that the fabrication techniques described herein may be usedto construct microstructures for use in other types of sensors,including RF filters, RF resonators, RF switches, optical sensors,optical connectors, chemical sensors, gas sensors, biological sensorsand actuators, as well as other types of applications.

FIGS. 1A and 1B depict an example resonator 10 constructed using themicrofabrication techniques described herein and referred to as a bellresonator. In an example embodiment, the resonator 10 has a length,width, and height from several micrometers (μm) to several centimeters(cm). During use, a part of the innermost region 12 (i.e., closest tothe symmetry axis) of the resonator 10 is anchored to a rigid support.The cross-section of the shell has a complex polynomial curve from theanchor point 12 to the rim 14. This complex shell helps the resonatorsto retain high stiffness in the vertical directions (parallel toZ-axis), low stiffness in the lateral directions (parallel to XY plane),low anchor loss, low thermoelastic damping, high effective mass, andhigh angular gain. Other shapes for the resonator 10 are contemplated bythis disclosure including but not limited to those shown in FIGS. 5A-5D.

FIGS. 2A-2H depict additional three-dimensional microstructures whichcan be fabricated using the microfabrication techniques described below.In these examples, the anchor region 12 is located at the center of themicrostructure with curved or straight walls extending at arbitraryangles from the anchor region 12 to a rim 14 located at the periphery ofthe structure. FIGS. 3A-3G depict three-dimensional microstructure withanchor regions having varying shapes; whereas, FIGS. 4A-4I depictthree-dimensional microstructures with different solid regions 16. Thesedifferent shapes are understood to be illustrative and not limiting ofthe shapes that may be formed using the microfabrication techniquesdescribed below

FIGS. 6A-6D illustrates an example technique for fabricatingthree-dimensional microstructures in accordance with this disclosure.First, the top mold 51 and the bottom mold 61 are micromachined using avariety of micromachining processes such as etching, milling, laserablation, sand blasting, and electro-discharge machining. In thisexample, the top mold 51 includes a recess 52 formed therein, such thatthe recess 52 defines a bottom surface 53 and at least one side surface54. Depending on the shape of the recess, there may be one or more sidesurfaces 54. In any case, the side surface(s) 54 further include aprotrusion 55 protruding into the recess 52 of the top mold 51. In thisexample, the recess 52 has a cylindrical shape with one step formed onthe side surface and serving as the protrusion 55. The top mold 51 mayfurther include a pillar 56 extending inward from the bottom surface 53of the recess 52.

The bottom mold 61 also includes a recess 62 formed therein, such thatthe recess defines a bottom surface 63 and at least one side surface 64.One or more through holes 65 may be formed in the bottom surface of thetop mold 51 and/or the bottom surface of the bottom mold 61. The one ormore through holes 65 may be fluidly coupled to a pressure source (e.g.,a vacuum).

A molding substrate 66 is disposed between the top mold 51 and thebottom mold 61 as shown in FIG. 6C. More specifically, the recess 52 inthe top mold 51 faces the recess 62 in the bottom mold 61 and therebyforms a cavity in the molds. The molding substrate 66 is substantiallyplanar and divides the cavity into two (i.e., top cavity and bottomcavity) when placed between the two molds. The molding substrate 66 maybe clamped onto the bottom mold 61 by weight, air pressure, or bonding.In some embodiments, the molding substrate 66 is a reflow material suchas fused silica, sapphire, ruby, silicon, and glass. Other types ofreflow materials may also be suitable for use. Some suitable materialsthat may be used include conductive materials and non-conductive high-Qmaterials that have a thin layer of conductive material coated on thesurface. The shape of the molding substrate 66 is not limited to planar.The substrate may be, for example curved or planar but with differenttopologies defined therein by etching, milling, etc.

Next, the molding substrate 66 is heated while the substrate 66 isdisposed between the molds 51, 61. The reflow molding occurs eitherabove the glass transition temperature (T_(g)) for non-crystallinematerial or above the melting point (T_(M)) of the source material(i.e., substrate). In an example embodiment, the temperature iscontrolled through the use of a blowtorch. It is envisioned that thetemperature of the reflow material can be controlled using a widevariety of methods including combustion heating, radiation heating,convection heating, conduction heating, and induction heating.

A pressure gradient is then created across the substrate 66 to reflowthe reflow material towards the top mold 51. In this example, thepressure of the cavity below the substrate (P_(cavity)) is made higherthan the ambient pressure (P_(ambient)) outside of the cavity formedwithin the molds 51, 61. The pressure gradient values depend on thethickness of the substrate 66 and the viscosity of the substrate duringmolding. In the case of a flat fused silica substrate with a thicknessof 100 μm at around 1600° C., a pressure gradient across the substrateof 200 Torr is sufficient. The pressure gradient drives the substrate 66away from the cavity and towards the stepped surface and the pillarformed in the top mold 51 as seen in FIG. 6D.

The shape of the sidewall of the reflown substrate is similar to (i.e.,mimics) the shape of the top mold 51. The reflow material may touch themold 51 when the temperature of the mold is equal to the temperature ofthe reflown material. However, when the temperature of the mold is keptlower than the reflown material, the substrate 66 cools down below T_(g)or T_(M) while it is reflown on the mold 51 due to transient heattransfer from the reflown material to the mold 51. In this case, thesubstrate 66 will only touch the corners of the mold 51 or will nottouch the mold 51 at all. Consequently, the roughness of the surface ofthe reflown substrate is very low (few Angstroms), because it is onlyaffected by the surface tension of the heated material. The smoothsurface of the microstructure is crucial for achieving high mechanicaland optical Q, because it causes very low energy loss on the surface ofthe microstructure. In this process, the temperature of the moldingsubstrate 66 is usually, but not limited to be, higher than thetemperatures of the molds 51, 61. Because of this temperaturedifference, the substrate is transiently cooled down by convection andconduction heat transfer phenomena as it approaches the molds within acertain distance. The substrate is cooled down below T_(M) or T_(g), andthe substrate does not deform further beyond that point. This is thereason why the substrate minimally touches the molds or does not touchthe molds at all and allow the substrate to obtain very smooth surface(e.g. <1 nm), which is crucial for achieving high Q. Using conventionalblow molding, casting, or injection molding techniques, the temperatureof the molds are either the same or higher than the temperature of thesubstrate. The shape of molded parts using these techniques is obviouslyan exact negative of the mold. The process disclosed here is a uniqueprocess that uses inexpensive molds with high surface roughness(e.g. >100 nm) yet create extremely smooth molded parts (e.g. <1 nm).

Lastly, the reflown substrate 66 is detached from the mold as seen inFIG. 6D. This fabrication process allows for a wide selection of moldmaterials. For example, a material with large mismatch in thecoefficient of thermal expansion (CTE) to the reflowed material can beallowed, because the fabrication process does not require permanentbonding between these materials. A mold material with a lower meltingtemperature than the reflowed material can also be used because of shortprocessing time (e.g., <10 s). The process is compatible with batchfabrication, and the mold can be used indefinitely.

FIGS. 7A-7E illustrate another example technique for fabricatingthree-dimensional microstructures. In this example, the bottom mold 72has a side surface with a protrusion 73 protruding into the recess and apillar 74 extending upward from the bottom surface of the bottom mold72; whereas, the top mold 71 merely includes a recess. The process issimilar to the process steps described in FIGS. 6A-6E, except that thepressure in the lower cavity 75 (P_(cavity)) is kept lower than theambient pressure (P_(ambient)) As a result, the substrate 66 reflowsdownward towards the bottom mold as shown in FIG. 7D. The value of thepressure gradient in this process is similar to the process in FIG. 6.Unlike the process shown in FIGS. 6A-6E, in the process shown in FIGS.7A-7E, molding can be done using only the bottom mold 72. This isbecause the molding substrate 66 can be clamped on the bottom mold ifP_(cavity) is kept lower than P_(ambient). Thus, in some embodiments,there is no need to clamp the substrate 66 using a top mold.

Microstructures can be created with features having different heights byapplying multiple pressure gradients across the molding substrate. FIGS.8A-8D illustrates an example method for fabricating a microstructurewith features having different heights. In this example, the recess inthe bottom mold 82 is partitioned into two or more cavities 83.Specifically, a middle pillar 84 is disposed in the center of the bottommold and surrounded by a concentric ring 85, thereby partitioning therecess into two different cavities 83. Through holes are machined intothe bottom surface of the bottom mold 82 such that each of the cavitiescan be fluidly coupled to a pressure source. In this example, the twoinner cavities are coupled to one pressure source (P_(cavity1)) and thetwo outer cavities are coupled to another pressure source (P_(cavity2)),where P_(cavity1)>P_(cavity2).

Structures having a small thermal mass and high thermal resistance canbe heated to a higher temperature than structures having a large thermalmass and low thermal resistance under the same amount of applied heat.For instance, during reflow molding, in the bottom mold 82 in FIG. 8B,the temperatures of the pillar 84 and the ring 85 (seen as the leftmostand rightmost pillars) become hotter than the boundary regions. This isbecause the pillar 84 and the ring 85 are narrow and tall so they havesmaller thermal mass than the boundary. In addition, the pillar 84 andthe ring 85 are surrounded by voids from both sides, so they are morethermally insulated than the boundary. The thermal mass and the thermalresistivity of the pillars 84 and the ring 85 are controlled with theirwidth and height as well as the width and height of the recesses 83.Molds having regions with lower thermal mass and higher thermalresistance than the boundary can be utilized to reflow more axisymmetricshells than the molds that do not include those regions. For example,the mold 82 in FIG. 8b can create more axisymmetric shells than mold 72in FIG. 7C. This is because the temperatures of the ring 85 in mold 82can become more axisymmetric than mold 72 even when the heat source(e.g. blowtorch) and the mold are misaligned and the mold is heatedasymmetrically. Misalignment between a heat source and a mold isinevitable; however, the extra recess defined on the other side of ring85 help the ring 85 to have more uniform temperature. In addition, thering 85 induces lower thermal stress and smaller thermal deformation tothe molding substrate 66 than the mold 72 in FIG. 7C, because it isheated closer to the temperature of the substrate 66. The embodiment ofthe molds for reflowing shells with high symmetry described here is notlimited to particular shape described in FIG. 8B.

With the molding substrate 66 disposed between the two molds, the reflowmaterial is heated above its melting temperature. Pressure gradients arethen created across the molding substrate 66. In this example, theambient pressure (P_(ambient)) is higher than P_(cavity1) orP_(cavity2). Because the pressure gradient between P_(ambient) andP_(cavity2) is larger than the pressure gradient between the P_(ambient)and P_(cavity1), the molding substrate 66 reflows deeper into the outercavities than the inner cavities as seen in FIG. 8D. Lastly, the reflownsubstrate 66 is detached from the molds as seen in FIG. 8E. Except forthe differences described above, this fabrication method is the same asthat described in relation to FIGS. 6A-6E.

FIGS. 9A-9D depict the process steps for fabricating microstructureswith hollow shells by reflow molding in the lateral directions. In asimilar manner, the bottom mold 92 includes a recess 94 formed therein,such that the recess 94 defines a bottom surface and at least one sidesurface. The bottom mold 92 further includes one or more pockets 95formed in the at least one side surface as seen in FIG. 9B. In oneexample, the pockets 95 are formed by two halves of the bottom mold 92.The pockets 95 may be fluidly coupled via through holes 96 to a pressuresource (e.g. a vacuum).

With reference FIG. 9C, the molding substrate disposed between the topmold and bottom mold and the reflow material is heated above its meltingtemperature. Pressure gradients are then created across the moldingsubstrate 66. The pressure inside the cavity 98 is first made smallerthan the ambient pressure outside the cavity, such that the moldingsubstrate 66 flow down towards the bottom surface of the bottom mold 92.The pressure inside the cavity 98 is then made larger than the ambientpressure so that the molding substrate 66 reflows laterally into thepockets 95. In FIG. 9D, the molded substrate 66 is detached from themold. The molding angle can be controlled with the angle of the patternsdefined on the bottom molds. This process allows the creation of hollow,solid, and/or a combination of both types of geometries. Except for thedifferences described above, this fabrication method is the same as thatdescribed in relation to FIGS. 6A-6E.

FIGS. 10A-10C show the process steps for a method that creates astructure consisting of regions with different thicknesses by moldingpowder, frit or small pieces of one or more kinds of material. Top andbottom molds 101, 102 are machined in the manner described above. A fritor small pieces of a thermally reflowable material 103 is disposedinside the bottom mold 102 as seen in FIG. 10A. The frit 103 is thencovered by the top mold 101. While heating the frit above T_(M) orT_(G), a downward force is applied to the top mold 101 to press thematerial into the shape defined by the top and bottom molds as seen inFIG. 10B. In FIG. 10C, the molded piece 105 is detached from the molds.

FIGS. 11A-11C show the steps of a sequential molding process that uses aformerly reflown piece as a mold for a second molded piece. First, amold 111 is prepared from a first material, for example using the reflowmolding technique described in FIG. 6. A thin layer of anti-stictionmaterial could be applied on top of the first mold 111. Frit of a secondmaterial 112 is applied on the recess of the first mold 111 as seen inFIG. 11A. The frit or powder reflows above its T_(g) or T_(M) onto thefirst mold 111. After cooling, the mold 111 is separated from the secondmaterial 112 as seen in FIG. 11C. This process allows the molding ofsolid parts with ultra-smooth surface quality using a starting mold withhigh degree of roughness.

FIGS. 12A-12F show the process steps to create a hollow microstructurebonded with solid pieces by simultaneously reflowing a substrate andwelding the substrate to solid pieces that are molded previously. InFIGS. 12A and 12B, the top and bottom molds 121, 122 are machined,respectively, in the manner described above. Frit of a reflowablematerial 123 is applied into the recesses located on the outside of thebottom mold 122 as seen in FIG. 12C. The frit 123 is then reflow molded.A second reflowable substrate 124 is clamped between the top and bottommolds 121, 122 as seen in FIG. 12D. Referring to FIG. 12E, the substrate124 is reflown towards the bottom of the bottom mold 122. During thisstep, the substrate 124 contacts and form fusion bonds with the fritmaterial 123. In FIG. 12F, the reflown sample is detached from themolds. The microstructure that is fabricated using this process can befabricated by aligning and bonding a shell and a solid piece that aremolded separately. However, using that technique, it is impossible toalign the shell and the solid piece perfectly accurately. Themisalignment between the shell and solid pieces is highly undesirable,because it can lead to a differences in capacitance formed between theseparts. The process described in FIG. 12 alleviates this problem. This isbecause the solid piece and the shell are self-aligned because both ofthem are molded from the same mold.

FIGS. 13A and 13B are the top and bottom views of an unreleased halftoroidal shell surrounded by solid, toroidal electrodes that wasfabricated using the method described in FIGS. 12A-12F. The hollow andsolid regions of the structure are connected by a flat substrate 131.After the removal of the substrate 131 using grinding and polishingtechniques, a vibratory rate-integrating gyroscope can be formed.

Stacks of different reflowable materials can also be used to createmicrostructures as shown in FIG. 14A-14E. The top and bottom molds 141,142 are machined as seen in FIGS. 14A and 14B, respectively. A stack ofthermally reflowable materials 143 are then clamped between two molds asseen in FIG. 14C. In this example, the stack of thermally reflowablematerials 143 is compised of three different materials: material 1,material 2 and material 3. The substrate is reverse blown toward thebottom mold as seen in FIG. 14D and then detached from the mold as seenin FIG. 14E. This method allows the co-fabrication of microstructurewith a wide selection of physical properties (conductivity,piezoelectricity, piezoresistivity, etc.) with readout-and-controlelectrodes to form a variety of micro-scale sensors and actuators.

FIG. 15A-15H show the process for fabricating a rate-integratinggyroscope through wafer-level simultaneous micro reflow molding andwelding, releasing, and assembly process. In FIG. 15A, a mold 151 ispatterned into the shape of a dome 152, with a through hole 153 formedin the center of the dome, and a rod 154 that is longer than the depthof the through hole 153 is inserted and fixed in the hole 153. Asubstrate 155 comprised of reflow material is placed on the top surfaceof the mold 151.

The substrate 155 is reshaped by heating the substrate above T_(M) orT_(G). A pressure gradient is applied concurrently across the substrate155 to reflow the substrate 155 down toward the dome 152. The substrate155 first touches and reflows around the rod 154. The substrate 155 thenreflows around the dome as seen in FIG. 15B. The rod and the substratesare welded at that point. It should be noted that the rod can also havelength equal or shorter than the depth of the cavity 153. This isbecause as the substrate 155 is reflown down toward the dome 152, thesubstrate can be reflown into the cavity 153 and be welded to the rod.Except for the differences described above, these fabrication steps arethe same as that described in relation to FIGS. 6A-6E.

After separating from the mold, the reformed substrate 155 istransferred to and bonded to a carrier wafer 161 as seen in FIG. 15C. InFIG. 15D, the carrier wafer 161 is attached face up to a jig 162 and thereformed substrate 155 is embedded with a polymer or frit. Next, the jig162 is ground and polished from the top to form the reflowed material ina bell shape. In FIG. 15F, the reformed material is cleaned andannealed, including dissolution of the polymer.

On a separate substrate 164, electrodes 165 are patterned using acombination of etching and electrode deposition process as seen in FIG.15G. This substrate 164 is preferably made with same material as thereformed substrate 155 in order to match the thermal expansioncoefficients to reduce the temperature sensitivity of the sensor. Eachrod 154 is then align-bonded to the electrode substrate 164. If thereflowed material is an insulating material, the shells are coated witha thin layer of conducting metal using sputtering or atomic layerdeposition processes. Lastly, the carrier substrate 161 is removed asseen in FIG. 17 h.

This technique allows us to form complex microstructures consisting ofshell and solid pieces. Strong fusion bonding between the shell andsolid parts has very low energy loss at the bonding interface, which iscritical for achieving high Q. The solid parts and the shell are selfaligned, so very high alignment accuracy can be achieved. The materialsthat are bonded in the welding step (FIG. 15B) need not be the samematerial. Both thin shell and solid rod can have arbitrary shapes. Thesolid pieces can be located at arbitrary locations. Reflow molding canbe done either upwards or downwards. It is also envisioned that thelength of the rod 154 does not need to be longer than the depth of therecess.

Another important feature of the process shown in FIGS. 15A-15H is thatthe released shell in FIG. 15F has gradually increasing thicknessprofile from the rim to the rod. This thickness profile is createdbecause, during the reflow molding step in FIG. 15B, the substrate 155is stretched by increasing amounts (i.e. experiences increasing amountsof plastic deformation) as it is reflowed from the top (i.e., where thesubstrate and the rod are welded) to the bottom of the dome 152. Thisthickness profile is highly desirable, because the shells can withstandlarger shock and can deform less under external vibrations (e.g. motors,engines, etc.) than the shells that have the opposite thicknessprofiles, such as the shells made using the processes shown in FIGS. 6through 8. Also, the shells made using the steps shown in FIG. 15A-15Hhave lower anchor loss and higher Q than the shells having the oppositethickness profile. This is because, in the wineglass modes (i.e.flexural modes), the mechanical energy of the shell is concentratedaround the rim by a greater amount than the shells that have theopposite thickness profile.

FIGS. 16A-16G show the fabrication steps for an example method that usesa thin sacrificial layer to form a narrow gap between a resonator andelectrodes. In this example, a substrate of a reflowable material 171 isreflown on top of a mold 172 as seen in FIG. 16A. A thin sacrificiallayer 173 is deposited on top of reflowed substrate 171 in FIG. 16B.Vacuum access holes 175 for controlling the pressure gradient duringmolding are created as seen in FIG. 16C. Another substrate of areflowable material 174 is reflown on top of the sacrificial layer 173in FIG. 16D. The combined microstructure is detached from the mold asseen in FIG. 16E and then is bonded to a support substrate 176 in FIG.16F. Lastly, the sacrificial layer 173 is removed (e.g., by etching) inFIG. 16G. The reflowable material 174 can be optionally patterned toform multiple electrodes that will be used to drive and sense the motionof the shell. The narrow gap between the resonator and electrodesachieve increased sensing and actuating capacitances which therebyincrease the sensing and actuating scale factor.

Once fabricated, the shapes of the different microstructures can bealtered using micro tools. For example, the fabrication steps to createa through hole at the center of a reflown geometry is shown in FIG.17A-17C. In this example, a micro needle 181 is inserted into thereflown sample 182 while it is hot, and it creates a hole through theshell as seen in FIG. 17B. In FIG. 17C, the needle 181 is removed fromthe blown sample 182 and the sample 182 is cooled down.

FIGS. 18A-18C shows another example of inserting a tube into a reflownshell 182. In FIG. 18A, a reflowable substrate 185 is reflown away fromthe bottom mold. A tube 186, carried by a micro needle 181, is insertedto the reflown shell 182 in FIG. 18B. The tube and the substrate can bewelded at or above T_(M) or T_(g). The reflowable substrate 185 and thetube 186 fusion bond, and the micro needle 181 is removed from the shell182 in FIG. 18C. These example are merely illustrative of the differenttechniques that can be used to alter the microstructures using microtools. In addition, the types of materials for the tube and substrateneed not be the same

The foregoing description of the embodiments has been provided forpurposes of illustration and description. It is not intended to beexhaustive or to limit the disclosure. Individual elements or featuresof a particular embodiment are generally not limited to that particularembodiment, but, where applicable, are interchangeable and can be usedin a selected embodiment, even if not specifically shown or described.The same may also be varied in many ways. Such variations are not to beregarded as a departure from the disclosure, and all such modificationsare intended to be included within the scope of the disclosure.

What is claimed is:
 1. A method for fabricating three-dimensionalmicrostructures, comprising: placing a solid member into a recess of afirst mold, wherein the recess is formed in a top surface of the firstmold and defines a bottom surface and at least one side surface, suchthat the solid member is releasably supported by the first mold;disposing a substantially planar reflow material on the first mold, suchthat the reflow material covers the recess and the solid member disposedin the recess, wherein the reflow material is the same material as amaterial comprising the solid member; heating the reflow material whilethe reflow material is disposed on the first mold; and creating apressure gradient across the reflow material to reflow the reflowmaterial towards and in contact with the solid member, whereby thereflow material bonds with the solid member to form a unitarythree-dimensional microstructure.
 2. The method of claim 1 furthercomprises controlling the pressure gradient across the reflow materialindependently from heating the reflow material.
 3. The method claim 1further comprises heating the reflow material using a heat source andcreating a pressure gradient across the reflow material using a vacuumthat differs from the heat source.
 4. The method of claim 1 furthercomprises heating the reflow material above a glass transitiontemperature for a non-crystalline material or above melting temperatureof the reflow material.
 5. The method of claim 1 further comprisesforming through holes in the bottom surface of the first mold andfluidly coupling the through holes to a pressure source.
 6. The methodof claim 1 further comprises detaching the unitary three-dimensionalmicrostructure from the first mold after the step of creating a pressuregradient across the reflow material.
 7. The method of claim 1 whereindimensions of the unitary three-dimensional microstructure are less thanone centimeter.
 8. The method of claim 1 wherein the first mold furtherincludes a dome protruding upward from the bottom surface of the recess,whereby the reflow material reflows around the dome and towards thebottom surface of the first mold, such that the reflow materialdecreases in thickness from top of the dome moving downwardly towardbottom of the dome.
 9. The method of claim 8 wherein the dome is formedwith a through hole at center of the dome and the solid member isdefined as a rod disposed in the through hole of the dome.
 10. Themethod of claim 1 wherein the reflow material is selected from a groupconsisting of fused silica, sapphire, ruby, silicon, glass and metal.11. The method of claim 10 further comprises controlling the pressuregradient across the reflow material independently from heating thereflow material.
 12. The method claim 10 further comprises heating thereflow material using a heat source and creating a pressure gradientacross the reflow material using a vacuum that differs from the heatsource.
 13. The method of claim 10 further comprises heating the reflowmaterial above a glass transition temperature for a non-crystallinematerial or above melting temperature of the reflow material.
 14. Themethod of claim 10 further comprises forming through holes in the bottomsurface of the first mold and fluidly coupling the through holes to apressure source.
 15. The method of claim 10 wherein dimensions of theunitary three-dimensional microstructure are less than one centimeter.16. The method of claim 10 wherein the dome is formed with a throughhole at center of the dome and the solid member is defined as a roddisposed in the through hole of the dome.
 17. A method for fabricatingthree-dimensional microstructures, comprising: providing a first moldhaving a recess formed in a top surface thereof wherein the recessdefines a bottom surface and at least one side surface and a domeprotrudes upwardly from the bottom surface of the recess; placing asolid member into a recess of a first mold, such that the solid memberis releasably supported by the first mold; disposing a substantiallyplanar reflow material on the top surface of the first mold, wherein thereflow material covers the recess and the solid member disposed in therecess; heating the reflow material while the reflow material isdisposed on the first mold; creating a pressure gradient across thereflow material concurrently with heating the reflow material to therebyreflow the reflow material into contact with the solid member, wherebythe reflow material bonds with the solid member to form a unitarythree-dimensional microstructure; and separating the unitarythree-dimensional microstructure from the first mold after the step ofcreating a pressure gradient across the reflow material.
 18. A methodfor fabricating a hemispherical resonator gyroscope, comprising:providing a first mold having a recess formed in a top surface thereofwherein the recess defines a bottom surface and at least one sidesurface and a dome protrudes upwardly from the bottom surface of therecess; placing a solid member into a recess of a first mold, such thatthe dome is formed with a through hole at center of the dome and thesolid member is defined as a rod disposed in the through hole of thedome; disposing a substantially planar reflow material on the topsurface of the first mold, wherein the reflow material covers the recessand the solid member disposed in the recess; heating the reflow materialwhile the reflow material is disposed on the first mold; creating apressure gradient across the reflow material concurrently with heatingthe reflow material to thereby reflow the reflow material into contactwith the solid member, whereby the reflow material bonds with the solidmember to form a hemispherical resonator; and separating thehemispherical resonator from the first mold after the step of creating apressure gradient across the reflow material.
 19. The method of claim 18further comprises polishing the hemispherical resonator after the stepof separating the hemispherical resonator from the first mold.
 20. Themethod of claim 19 further comprises coating an exterior surface of thehemispherical resonator with a metal after the step of polishing thehemispherical resonator.